4U / Tower 機架式

- Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
- 16 DIMMs; up to 4TB 3DS ECC, DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
- 4 PCI-E 3.0 x16 (double-width) slots,
2 PCI-E 3.0 x16 (single-width) slots,
1 PCI-E 3.0 x4 (in x8) slot
- 8 Hot-swap 3.5" drive bays
- 2x 10GBase-T LAN ports
- 1 VGA, 2 COM, 5 USB 3.0
- 4 Heavy duty fans, 4 exhaust fans, and 2 active heatsink with optimal fan speed control
- 2200W Redundant Power Supplies Titanium Level (96%)
- GPU Kit for passive GPU support (MCP-320-74702-0N-KIT)

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s,Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots,4 PCI-E 3.0 x16 slots,2 PCI-E 3.0 x8 (1 in x16) slots support Thunderbolt 2.0 AOC,1 PCI-E 2.0 x4 (in x8) slot;Up to 4 NVIDIA® GPU,I/O ports: 1 VGA, 2 COM, 2 GbE, 10 USB 2.0, & 1 IPMI Dedicated LAN

- 3D Rendering
- Astrophysics, Chemistry
- Cloud and Virtualization needs
- Cloud Computing
- Compute Intensive Application
- Dual Root System for balanced
performance & higher CPU to GPU
communication

- Up to 8 NVIDIA® Tesla® P100 SXM2
- Up to 80 GB/s GPU-to-GPU NVIDIA® NVLINK™
- Supports NVIDIA® GPUDirect™ RDMA

- Up to 8 NVIDIA® Tesla® P100 SXM2
- Up to 80 GB/s GPU-to-GPU NVIDIA® NVLINK™
- Supports NVIDIA® GPUDirect™ RDMA

GPUs under Single-Root complex ,Supports RDMA
Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s,Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots, 2 10GBase-T LAN with Intel® X540